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(Fig. 6-1).

Fig. 6-1

7. Assembly OP ENG

7.1 Assemble “Baffle DMD” to “HSG DMD” (Fig.7-1).

7.2 Assemble Chip B/D Module to “HSG DMD” (Fig. 7-2).

Fig.7-1

Fig.7-2

7.3 Assemble Thermal Pad & Gasket Hest-sink then place contact DMD (Fig. 7-3).

(1) Pre-fastening Sequence: [ 1 ] - [ 2 ] - [ 3 ] - [ 4 ].

(2) Fastening Sequence: [ 4 ] - [ 3 ] - [ 2 ] - [ 1 ].

(3) Screw Torque must be confirmed to be 6 kg-cm.

Screw

Shield CW

BKT Link Lamp

Fixed shafts of

DMD HSG

Fixed holes of

ILL SUB HSG

Fixed holes of DMD Fixed shafts of

DMD HSG

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Acer VZ.J9000.001 Datenblatt Seite 45