Acer AT2605 Bedienungsanleitung Seite 15

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<11006749 001>
Page 11 of 50
IEC/EN 60065
Clause RequirementTest Result - Remark Verdict
11 FAULT CONDITIONS
P
11.1 No shock hazard under fault condition
Evaluation during SPS and
DC/AC inverter approval. Refer
to appended table 11.1 for
blocked opening test.
P
11.2 Heating under fault condition No fire hazards, no excessive
temperatures.
P
No hazard from softening solder No solder point became soft.
P
11.2.1 Measurement of temperature rises (See appended table)
P
11.2.2 Temperature rise of accessible parts (See appended table)
P
11.2.3 Temperature rise of parts, other than windings,
providing electrical insulation
(See appended table)
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
Temperatures were not
exceeded.
N
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than 2 cm²
Temperatures were not
exceeded.
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
Temperatures were not
exceeded.
N
Meets all the special conditions if conductors on
printed circuit boards are interrupted
N
Class I protective earthing maintained No loose.
P
11.2.4 Temperature rise of parts acting as a support or
mechanical barrier
(See appended table)
P
11.2.5 Temperature rise of windings (See appended table)
P
11.2.6 Temperature rise of parts not subject to the limits
of 11.2.1 to 11.2.5
(See appended table)
P
12 MECHANICAL STRENGTH
P
12.1.1 Bump test where mass >7 kg No damage.
P
12.1.2 Vibration test
Compliance checked.
P
12.1.3 Impact hammer test
No damage to the apparatus
after the impact test.
P
Steel ball test
No damage to the apparatus
after the steel ball test.
P
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